LRDIMM 32GB

Samsung Electronics Co., Ltd.., One of the major players in the memory industry announced its latest development. They are now successfully producing reduce the memory load of dual inline memory modules (LRDIMM) 32GB to the server.

This memory module itself will be mass produced in mid 2010. With 40 nanometer production technology, four-gigabit chip Samsung introduced earlier this year will complete the module.

"The new 32GB LRDIMM will accommodate the next generation of servers that are designed for virtual, cloud computing and other applications with high capacity," said Ding Soo Jun, Executive Vice President, Memory Marketing Samsung Electronics Semiconductor Business, in his testimony, June 30, 2010.

"By developing technology-reduced load module with DDR3 40nm-class, we emphasize our goal of combining the capacity and best performance for the latest generation servers," he said.

Samsung's prototype consists of 72 LRDIMM 32GB 4GB DDR3 chip and memory chips in addition to helping reduce the burden of memory sub-system as much as 75 percent.

By using LRDIMM 32GB, memory capacity can be increased up to 384GB per CPU. In a two-way server systems, capacity can be increased to 768GB, or about 1.5 times with 512GB server systems equipped with DDR3 RDIMM 32GB.

Servers equipped with LRDIMM can process data at speeds 1333 megabit per second (Mbps), about 70 percent faster than the previous speed 800Mbps.